CVE-2023-33063
Qualcomm Multiple Chipsets
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
What it is
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
What to do
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Vendor notices and references
Description and required action as published by CISA. Full record at NVD.
Other Qualcomm entries on the list
- Multiple Chipsets Qualcomm Multiple Chipsets Memory Corruption Vulnerability CVE-2026-21385 · Mar 3, 2026
- Multiple Chipsets Qualcomm Multiple Chipsets Use-After-Free Vulnerability CVE-2025-27038 · Jun 3, 2025
- Multiple Chipsets Qualcomm Multiple Chipsets Incorrect Authorization Vulnerability CVE-2025-21480 · Jun 3, 2025
- Multiple Chipsets Qualcomm Multiple Chipsets Incorrect Authorization Vulnerability CVE-2025-21479 · Jun 3, 2025
- Multiple Chipsets Qualcomm Multiple Chipsets Use-After-Free Vulnerability CVE-2024-43047 · Oct 8, 2024
- Multiple Chipsets Qualcomm Multiple Chipsets Integer Overflow Vulnerability CVE-2023-33107 · Dec 5, 2023